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| Technische Information / Technical Information IGBT-Module IGBT-Modules BSM300GB120DLC Hochstzulassige Werte / Maximum rated values Elektrische Eigenschaften / Electrical properties Kollektor-Emitter-Sperrspannung collector-emitter voltage Kollektor-Dauergleichstrom DC-collector current Periodischer Kollektor Spitzenstrom repetitive peak collector current Gesamt-Verlustleistung total power dissipation Gate-Emitter-Spitzenspannung gate-emitter peak voltage Dauergleichstrom DC forward current Periodischer Spitzenstrom repetitive peak forw. current Grenzlastintegral der Diode 2 I t - value, Diode Isolations-Prufspannung insulation test voltage tP = 1 ms Tvj =25C TC = 80 C TC = 25 C tP = 1 ms, TC = 80C VCES IC,nom. IC ICRM 1200 300 625 600 V A A A TC= 25C, Transistor Ptot 2,5 kW VGES +/- 20V V IF 300 A IFRM 600 A VR = 0V, t p = 10ms, T Vj = 125C It 2 19 kA s 2 RMS, f = 50 Hz, t = 1 min. VISOL 2,5 kV Charakteristische Werte / Characteristic values Transistor / Transistor Kollektor-Emitter Sattigungsspannung collector-emitter saturation voltage Gate-Schwellenspannung gate threshold voltage Gateladung gate charge Eingangskapazitat input capacitance Ruckwirkungskapazitat reverse transfer capacitance Kollektor-Emitter Reststrom collector-emitter cut-off current Gate-Emitter Reststrom gate-emitter leakage current IC = 300A, V GE = 15V, Tvj = 25C IC = 300A, V GE = 15V, Tvj = 125C IC = 12mA, V CE = VGE, Tvj = 25C VGE(th) VCE sat min. 4,5 typ. 2,1 2,4 5,5 max. 2,6 2,9 6,5 V V V VGE = -15V...+15V QG - 3,2 - C f = 1MHz,Tvj = 25C,V CE = 25V, V GE = 0V Cies - 21 - nF f = 1MHz,Tvj = 25C,V CE = 25V, V GE = 0V Cres - 1,4 - nF VGE= 0V, Tvj= 25C, V CE= 1200V ICES - - 5 mA VCE = 0V, V GE = 20V, Tvj = 25C IGES - - 400 nA prepared by: MOD-D2; Mark Munzer approved by: SM TM; Wilhelm Rusche date of publication: 2003-01-29 revision: 3.0 1 (9) DB_BSM300GB120DLC_3.0 2003-01-29 Technische Information / Technical Information IGBT-Module IGBT-Modules BSM300GB120DLC Charakteristische Werte / Characteristic values Transistor / Transistor Einschaltverzogerungszeit (ind. Last) turn on delay time (inductive load) IC = 300A, V CE = 600V VGE = 15V, R G = 3,3, Tvj = 25C VGE = 15V, R G = 3,3, Tvj = 125C Anstiegszeit (induktive Last) rise time (inductive load) IC = 300A, V CE = 600V VGE = 15V, R G = 3,3, Tvj = 25C VGE = 15V, R G = 3,3, Tvj = 125C Abschaltverzogerungszeit (ind. Last) turn off delay time (inductive load) IC = 300A, V CE = 600V VGE = 15V, R G = 3,3, Tvj = 25C VGE = 15V, R G = 3,3, Tvj = 125C Fallzeit (induktive Last) fall time (inductive load) IC = 300A, V CE = 600V VGE = 15V, R G = 3,3, Tvj = 25C VGE = 15V, R G = 3,3, Tvj = 125C Einschaltverlustenergie pro Puls turn-on energy loss per pulse Abschaltverlustenergie pro Puls turn-off energy loss per pulse Kurzschluverhalten SC Data Modulinduktivitat stray inductance module Modul Leitungswiderstand, Anschlusse - Chip module lead resistance, terminals - chip IC = 300A, V CE = 600V, V GE = 15V RG = 3,3, Tvj = 125C, L = 60nH IC = 300A, V CE = 600V, V GE = 15V RG = 3,3, Tvj = 125C, L = 60nH tP 10s, V GE 15V, R G = 3,3 TVj125C, V CC=900V, V CEmax=VCES -LCE *di/dt Anschlusse / terminals 2-3 ISC LCE 1800 25 A nH Eoff 36 mJ Eon 35 mJ tf 0,04 0,05 s s td,off 0,57 0,57 s s tr 0,05 0,07 s s td,on 0,05 0,06 s s min. typ. max. pro Zweig / per arm, TC=25C RCC`+EE` - 0,60 - m Charakteristische Werte / Characteristic values Diode / Diode Durchlaspannung forward voltage Ruckstromspitze peak reverse recovery current IF = 300A, V GE = 0V, Tvj = 25C IF = 300A, V GE = 0V, Tvj = 125C IF = 300A, - di F/dt = 5400A/s VR = 600V, V GE = -15V, Tvj = 25C VR = 600V, V GE = -15V, Tvj = 125C Sperrverzogerungsladung recovered charge IF = 300A, - di F/dt = 5400A/s VR = 600V, V GE = -15V, Tvj = 25C VR = 600V, V GE = -15V, Tvj = 125C Abschaltenergie pro Puls reverse recovery energy IF = 300A, - di F/dt = 5400A/s VR = 600V, V GE = -15V, Tvj = 25C VR = 600V, V GE = -15V, Tvj = 125C Erec 9 21 mJ mJ Qr 28 58 C C IRM 348 420 A A VF min. - typ. 1,8 1,7 max. 2,3 2,2 V V 2 (9) DB_BSM300GB120DLC_3.0 2003-01-29 Technische Information / Technical Information IGBT-Module IGBT-Modules BSM300GB120DLC Thermische Eigenschaften / Thermal properties min. Innerer Warmewiderstand thermal resistance, junction to case Ubergangs-Warmewiderstand thermal resistance, case to heatsink Hochstzulassige Sperrschichttemperatur maximum junction temperature Betriebstemperatur operation temperature Lagertemperatur storage temperature pro Transistor / per transistor, DC pro Diode / per Diode, DC pro Modul / per module Paste = 1 W/m * K / grease = 1 W/m * K RthCK RthJC - typ. 0,010 max. 0,050 0,125 K/W K/W K/W Tvj max - - 150 C Tvj op -40 - 125 C Tstg -40 - 125 C Mechanische Eigenschaften / Mechanical properties Gehause, siehe Anlage case, see appendix Innere Isolation internal insulation Kriechstrecke creepage distance Luftstrecke clearance distance CTI comperative tracking index Anzugsdrehmoment f. mech. Befestigung mounting torque Anzugsdrehmoment f. elektr. Anschlusse terminal connection torque Gewicht weight Schraube / screw M6 M 3,0 Al2O3 20 mm 11 mm 225 - 6,0 Nm Anschlusse / terminals M6 M 2,5 - 5,0 Nm G 340 g Mit dieser technischen Information werden Halbleiterbauelemente spezifiziert, jedoch keine Eigenschaften zugesichert. Sie gilt in Verbindung mit den zugehorigen Technischen Erlauterungen. This technical information specifies semiconductor devices but promises no characteristics. It is valid in combination with the belonging technical notes. 3 (9) DB_BSM300GB120DLC_3.0 2003-01-29 Technische Information / Technical Information IGBT-Module IGBT-Modules BSM300GB120DLC Ausgangskennlinie (typisch) Output characteristic (typical) IC = f (VCE) V GE = 15V 600 500 Tvj = 25C Tvj = 125C 400 IC [A] 300 200 100 0 0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 4,0 VCE [V] Ausgangskennlinienfeld (typisch) Output characteristic (typical) 600 IC = f (VCE) T vj = 125C 500 VGE = 17V VGE = 15V 400 VGE = 13V VGE = 11V VGE = 9V VGE = 7V IC [A] 300 200 100 0 0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 4,0 4,5 5,0 VCE [V] 4 (9) DB_BSM300GB120DLC_3.0 2003-01-29 Technische Information / Technical Information IGBT-Module IGBT-Modules BSM300GB120DLC Ubertragungscharakteristik (typisch) Transfer characteristic (typical) IC = f (VGE) VCE = 20V 600 500 Tvj = 25C Tvj = 125C 400 IC [A] 300 200 100 0 5 6 7 8 9 10 11 12 VGE [V] Durchlakennlinie der Inversdiode (typisch) Forward characteristic of inverse diode (typical) 600 IF = f (VF) 500 Tvj = 25C Tvj = 125C 400 IF [A] 300 200 100 0 0,0 0,5 1,0 1,5 2,0 2,5 3,0 VF [V] 5 (9) DB_BSM300GB120DLC_3.0 2003-01-29 Technische Information / Technical Information IGBT-Module IGBT-Modules BSM300GB120DLC Schaltverluste (typisch) Eon = f (IC) , Eoff = f (IC) , Erec = f (IC) Switching losses (typical) VGE=15V, RG =3,3 , VCE = 600V, T vj = 125C 100 90 80 70 E [mJ] 60 50 40 30 20 10 0 0 100 200 300 400 500 600 Eoff Eon Erec IC [A] Schaltverluste (typisch) Switching losses (typical) 160 140 120 100 E [mJ] 80 60 40 20 0 2 4 6 8 10 Eoff Eon Erec Eon = f (RG) , Eoff = f (RG) , Erec = f (RG) VGE=15V , I C = 300A , V CE = 600V , T vj = 125C 12 14 16 18 20 22 RG [] 6 (9) DB_BSM300GB120DLC_3.0 2003-01-29 Technische Information / Technical Information IGBT-Module IGBT-Modules BSM300GB120DLC Transienter Warmewiderstand Transient thermal impedance ZthJC = f (t) 1 0,1 ZthJC [K / W] 0,01 Zth:Diode Zth:IGBT 0,001 0,001 0,01 0,1 1 10 t [s] i ri [K/kW] : IGBT i [s] : IGBT ri [K/kW] : Diode i [s] : Diode 1 21,02 6,499E-02 52,55 6,499E-02 2 25,19 2,601E-02 62,97 2,601E-02 3 2,85 2,364E-03 7,13 2,364E-03 4 0,94 1,187E-05 2,35 1,187E-05 Sicherer Arbeitsbereich (RBSOA) Reverse bias safe operation area (RBSOA) 700 600 500 VGE = 15V, R G = 3,3 , T vj= 125C IC [A] 400 300 200 100 0 0 IC,Modul IC,Chip 200 400 600 800 1000 1200 1400 VCE [V] 7 (9) DB_BSM300GB120DLC_3.0 2003-01-29 Technische Information / Technical Information IGBT-Module IGBT-Modules BSM300GB120DLC 8 (9) DB_BSM300GB120DLC_3.0 2003-01-29 Technische Information / Technical Information IGBT-Module IGBT-Modules BSM300GB120DLC Anhang C-Serie Appendix C-series Gehause spezifische Werte Housing specific values CTI comperative tracking index Modulinduktivitat stray inductance module Modul Leitungswiderstand, Anschlusse - Chip module lead resistance, terminals - chip terminals 2-3 pro Zweig/per arm RCC`+EE` TC=25C 0,6 m LCE typ. 425 20 nH Gehausemae C-Serie Package outline C-series 9 (9) DB_BSM300GB120DLC_3.0 2003-01-29 |
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